MTorrice writes “Researchers have demonstrated a way to make high performance, flexible integrated circuits using almost exclusively standard equipment and materials already needed to make conventional chips. Such a method could allow electronics manufacturers to build new devices, such as smart medical implants and flexible displays, without needing to significantly overhaul current production protocols. The method, developed by researchers at the University of Texas, Austin, started with researchers patterning integrated circuits on silicon wafers using a standard production line. They then cut off the top 20 to 30 micrometers of the wafer using a thin wire—like slicing a block of cheese—to produce a thin, flexible platter of circuits.” Read more of this story at Slashdot.
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Flexible Circuits By the Slice
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