An anonymous reader writes Over the past few months, we’ve seen a disturbing trend from first Kingston, and now PNY. Manufacturers are launching SSDs with one hardware specification, and then quietly changing the hardware configuration after reviews have gone out. The impacts have been somewhat different, but in both cases, unhappy customers are loudly complaining that they’ve been cheated, tricked into paying for a drive they otherwise wouldn’t have purchased. Read more of this story at Slashdot.
Read more here:
Kingston and PNY Caught Bait-and-Switching Cheaper Components After Good Reviews
A rat’s nest of cables at the back of a desk is truly the sign of the gadget-obsessed. But Intel plans to end all that, and soon: it wants your desk—hell, your entire digital life—to be completely wireless by 2016. Read more… 
Tekla Perry (3034735) writes “Former Sun executives and employees gathered in Mountain View, Calif., in May, and out came the ‘real’ stories. Andy Bechtolsheim reports that Steve Jobs wasn’t the only one who set out to copy the Xerox Parc Alto; John Gage wonders why so many smart engineers couldn’t figure out that it would have been better to buy tables instead of kneepads for the folks doing computer assembly; Vinod Khosla recalls the plan to ‘rip-off Sun technology, ‘ and more.” Read more of this story at Slashdot. 
Lucas123 writes: “The USB SuperSpeed+ spec (a.k.a. v3.1) offers up to 10Gbps throughput. Combine that with USB’s new C-Type Connector, the specification for which is expected out in July, and users will have a symmetrical cable and plug just like Thunderbolt but that will enable up to 100 watts of power depending on the cable version. So where does that leave Thunderbolt, Intel’s other hardware interconnect? According to some analysts, Thunderbolt withers or remains a niche technology supported almost exclusively by Apple. Even as Thunderbolt 2 offers twice the throughput (on paper) as USB 3.1, or up to 20Gbps, USB SuperSpeed+ is expected to scale past 40Gbps in coming years. ‘USB’s installed base is in the billions. Thunderbolt’s biggest problem is a relatively small installed base, in the tens of millions. Adding a higher data throughput, and a more expensive option, is unlikely to change that, ‘ said Brian O’Rourke, a principal analyst covering wired interfaces at IHS.” Read more of this story at Slashdot. 
Undersea energy pipelines constitute a vital physical link between deep water wells and onshore refineries, but it’s not like we can just lay these lines like oversized bendy straws. That task of constructing and sinking these tubes instead falls to vessels like Allseas’ newest addition to its pipelaying fleet, the Audacia. Read more… 
MojoKid (1002251) writes “AMD has just announced their upcoming mainstream, low-power APUs (Accelerated Processing Units), codenames Beema and Mullins. These APUs are the successors to last year’s Temash and Kabini APUs, which powered an array of small form factor and mobile platforms. Beema and Mullins are based on the same piece of silicon, but will target different market segments. Beema is the mainstream part that will find its way into affordable notebook, small form factor systems, and mobile devices. Mullins, however, is a much lower-power derivative, designed for tablets and convertible systems. They are full SoCs with on-die memory controllers, PCI Express, SATA, and USB connectivity, and a host of other IO blocks. AMD is announcing four Beema-based mainstream APUs today, with TDPs ranging from 10W – 15W. There are three Mullins-based products being announced, two quad-cores and a dual-core. The top of the line-up is the A10 Micro-6700T. It’s a quad-core chip, with a max clock speed of 2.2GHz, 2MB of L2, and a TDP of only 4.5W. In the benchmarks, the A10-6700T quad core is actually able to surpass Intel’s Bay Trail Atom platform pretty easily across a number of tests, especially gaming and graphics.” Read more of this story at Slashdot.