Reducing the Heat In Computing


Graphene + Copper (not to scale, obviously) About a year ago, I traveled to Cornell University to interview a bunch of materials scientists who work at the nanoscale level. This means they work with stuff that is very, very tiny. A nanometer is a billionth of a meter. One of the challenges nearly all of the scientists kept mentioning is the issue of overheating in electronics. Most of us are directly familiar with the heat released from our computers when we balance them on our lap for a period of time, for example. And this becomes a big deal as devices get smaller and smaller. The smaller the copper wires—which connect chips, among other things—the more heat they emit. This is important for future devices and wearables. Scientists are exploring all kinds of solutions but a proven one has recently been announced in the journal Nano Letters. We’ve mentioned the magic material graphene before and it continues to be the superhero material, coming to the rescue over and over again. This time, it shows up as a possible damper for heated copper wires. Graphene is a one-atom thick material that can move electrons and heat. And it is able to cling to copper. Apparently by sandwiching copper between layers of graphene, the heat created by the metal is decreased by 25 percent. When attached to copper, the graphene actually changes its structure in such a way that allows the heat to move more freely through the metal, instead of being trapped in it. From left: (1) copper before any processing, (2) copper after thermal processing; (3) copper after adding graphene. Image via UCR Today (more…)

Originally posted here:
Reducing the Heat In Computing


Please enter your comment!
Please enter your name here


This site uses Akismet to reduce spam. Learn how your comment data is processed.